Attend our Keynote and Visit Booth 107 for FADU Talks at the end of your FMS day
Santa Clara, Calif., – August 1, 2022 – FADU Technology is a fabless semiconductor company delivering advanced Flash controllers, customizable firmware, SSD storage technology and Flash storage supply chain innovations to meet the ever-increasing data storage demands placed on OEM and hyperscale data centers. In the FADU Theater, located in Booth 107, company technologists will present three of technical papers starting at 4:30PM on Tuesday August 2nd and Wednesday, August 3rd. Audience members are eligible to receive a appreciation gift from FADU. FADU CEO and Co-Founder Jihyo Lee and guest Ross Stenfort of Meta will present an opening day keynote on SSD storage challenges of Hyperscale Datacenters.
FADU Keynote with Jihyo Lee
CEO and Co-Founder of FADU
Tue 8/2 @ 1:40PM in the Mission Ballroom
Keynote: “Challenges and Opportunities for Designing Efficient SSDs for Datacenter.”
Headlining FADU’s innovation discussions at Flash Memory Summit 2022 is FADU CEO Jihyo Lee, whom, with guest Ross Stenfort, Hardware Storage Engineer at Meta, will help kick-off the tradeshow on Tuesday, August 2nd with an early keynote discussion on the challenges Hyperscale datacenters face with SSD form factors, performance, power, and standards and the FADU’s perspective on how the industry can address the challenges.
FADU Talk with John Choi, Ph.D.
Chief Architect and Executive Director of FADU
Tue 8/2, Wed 8/3 @ 4:30PM at the FADU Theater in Booth 107
Presentation: “How to design a high-performance & low-power Enterprise SSD Controller”
Enterprise-class SSD controllers have contradictory requirements: deliver both high-performance and good QoS characteristics (e.g., 5-9s) but do so while consuming low power. This puts a serious burden on handling high-level parallel operations very efficiently.
FADU Talk with Steve (Wonmo) Yang, Ph.D.
Hardware Team Leader at FADU
Tue 8/2, Wed 8/3 @ 5:00PM at the FADU Theater in Booth 107
Presentation: “Challenges in implementing PCIe Gen 5.0 NVMe SSD with low-end FR4 PCB”
SSD designers desire to continue using FR-4 based copper (called FR4 PCB) in upcoming PCIe Gen5 designs, but the challenges are significant without changing materials. This paper details FADU’s analysis of simulations of singnal transmission properties using low-end FR4 PCB at PCIe Gen 5.0 levels.
FADU Talk with Derek (Taeyamg) Kim
Hardware Engineer at FADU
Tue 8/2, Wed 8/3 @ 5:30PM at the FADU Theater in Booth 107
Presentation: “Cost and time-efficient methodology to validate compatibility for the electrical and side-band digital signals of NVMe SSD”
There are numerous host systems with various CPUs, chipset, manufacturers, and customer requirements, but customers require strict electrical compatibility. This paper presents a methodology by FADU to generate electrical and side-band digital signals of NVMe SSD test results on the various types of host systems.
FADU Talk with Anu Murthy
Vice President, Marketing at FADU
Tue 8/2, Wed 8/3 @ 6:00PM at the FADU Theater in Booth 107
Presentation: “FADU Products and Storage Solutions Overview”
Learn about the volume production status of FADU’s Gen4 controller and SSD solutions and the progress towards the introduction of the industry’s first Gen5 controller and OCP SSD designs with FDP support in 2023.
To learn more about FADU’s enterprise storage solutions, visit https://www.fadu.io.